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Polymer microparticles for drilling applications

The polymer microparticle "Techpolymer" has the characteristic of thermal decomposition and can be used as a pore-forming material.

The polymer microparticle "Tech Polymer" has the characteristic of thermal decomposition and can be used as a pore-forming material. It is primarily mixed with ceramic powders or metal powders, and during firing, the particles burn away, creating spherical pores. Additionally, a significant feature of "Tech Polymer" is that it produces very little residue after decomposition. 【Features】 ■ Particle Size, Particle Size Distribution, and Shape We offer a wide range of particle sizes from submicron to micron. It is also possible to achieve a sharp particle size distribution, contributing to uniform pore formation. In addition to the main spherical microparticles, we also have irregularly shaped particles such as biconvex lens-shaped and hemispherical particles, making it suitable for forming special pores. ■ Low Residue Tech Polymer has minimal residue after decomposition. ■ Environmental Consideration By using hollow microparticles and low-temperature thermal decomposition microparticles, we can propose products that contribute to energy reduction, and by using biomass particles, we can help reduce carbon emissions, thus promoting environmental consideration.

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Polymer microparticles for lighting and compounds

"Tech Polymer" can be used as an additive to impart light diffusion properties and AB characteristics in compounds and masterbatches.

In residential and commercial lighting fixtures, as well as in the decorative and partial lighting fields primarily for vehicles, various resin molded products are used as additives. The polymer microparticles known as "Tech Polymer" differ from inorganic materials, offering a wide range of particle sizes and various customization options. Additionally, they are well-regarded for their stability in particle size distribution. Composition: Cross-linked acrylic-based and cross-linked polystyrene-based Particle Size: 1.5μm to 200μm *Some submicron and nanosize options are also available Particle Size Distribution: Polydisperse and monodisperse Shape: True spherical, hollow, and irregular (biconvex lens, etc.) Refractive Index: 1.49 to 1.59 Heat Resistance: 250 to 270°C *High heat-resistant grades above 300°C are also available Expected Effects: Light diffusion, low dielectric, hollowing, stress relief

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Polymer microparticles for low dielectric applications in the field of electronic materials

"Tech Polymer" is proposing solutions for low dielectric applications that reduce transmission loss in the high-frequency range.

We would like to introduce our development products aimed at the development of low-dielectric semiconductors and substrates that can suppress signal transmission loss in the high-frequency range required for the next-generation mobile communication system, 5G, which enables high-speed communication of large-capacity data. 【Product Overview】 Particle Structure: Solid Type Particle Structure: Hollow Type For information on particle size, particle size distribution, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Particle Size Adjustment Particle Surface Modification (Dispersion Improvement) 【Application Examples】 Additives for materials in semiconductor packaging and mounting fields.

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Polymer microparticles for adhesive and adhesive applications

Polymer microparticles "Tech Polymer" can be used as functional additives for spacers, flexibility, stress relaxation, low dielectric properties, and light diffusion.

"Tech Polymer" is a polymer microparticle based on acrylic, styrene, and other materials. By adding it to adhesives and tackifiers, it can impart functions such as gap adjustment, flexibility, stress relaxation, low dielectric properties, and changes in optical characteristics. We can propose the optimal grade according to your needs. 【Features】 ■ Particle Size and Distribution The particle size can be adjusted from submicron levels to several hundred micrometers. Additionally, the particle size distribution can be sharply customized. It can be considered as a gap adjustment agent. ■ Flexibility We offer multiple grades with varying hardness. By adding it to adhesives and tackifiers, stress relaxation effects can be expected. ■ Hollowing We also have hollow microparticles that contain air layers inside. These can be considered for applications requiring low dielectric properties in electronic materials. ■ Refractive Index The refractive index can be adjusted between 1.49 and 1.59. It can be considered when you want to maintain transparency or impart light diffusion properties.

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